2026.06.17

2026.06.17 "Mold and Semiconductor Packaging Ultra-Precision Machining Technology and Materials Application Seminar"

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Held on June 17 in Taichung, the "Precision Manufacturing · Cross-Industry Co-Prosperity – Mold and Semiconductor Packaging Ultra-Precision Machining Technology and Materials Application Seminar" generated lively discussion and interaction, receiving positive feedback and recognition from participating manufacturers.

As Taiwan's first liquid alloy material IP design company, Tai-Jin Materials demonstrated how "industrial innovation" can transform the traditional metal processing dilemma of "high cost, low performance, and non-environmentally friendly" into a high-profit blue ocean market characterized by "low cost, high performance, and ESG compliance." The combination of new materials and new processes delivers substantial economic and environmental benefits. From aerospace, military precision, automotive, and motorcycle industries to semiconductor equipment, the liquid alloy micro-particle peening process undeniably provides a key to unlocking Taiwan's manufacturing upgrade, breaking through technological barriers, and advancing toward sustainable development.

Japan's TOWA has maximized the potential of cBN and super-hard tools through deep understanding of material mechanics and advanced coating technologies. This empowers manufacturers with stronger technical support when facing high-hardness mold steel and aerospace-grade difficult-to-cut materials.

Through this seminar, Japan's Toyo Tanso demonstrated the critical role that high-performance carbon materials play in modern precision manufacturing. Against the backdrop of global supply chain fluctuations and persistently high prices of rare metals such as tungsten, copper-graphite electrodes—which contain no rare metals and offer low cost with high efficiency—present a new path that combines economic benefits with technological breakthroughs for Taiwan's mold and semiconductor packaging industries. This reminds us that process optimization should not be limited to adjusting machine parameters; it is through "materials innovation" at the source that we can truly break through the physical limitations of conventional processes, helping Taiwan's manufacturing industry maintain a leading competitive edge in the global precision mold and semiconductor supply chain.