February 9, 2026

■ Date & Time:
Tuesday, March 17, 2026 (Reiwa 8), 14:00 – 16:45 (JST)

■ Format:
Online via Zoom

■ Participation Fee:
Free of charge

■ Event Overview
★ Technology Presentation Seminar ★ (14:00 – 16:45)
Five leading companies will present cutting-edge technologies related to dies and molds.

Detailed Program

1. Almonicos Co., Ltd.
   “Introduction to Sheet Thickness Evaluation Technology for Press Panels Using 3D Non-Contact Measurement Systems”
2. Sayama Die & Mold Mfg. Co., Ltd.
   “Development of a Patented ‘Gate Cutting System’—Achieving Ultra-High Precision Without Secondary Operations”
3. Hiraoka Kogyo Co., Ltd.
   “Ultrasonic Machining Technology”
4. CAE Solutions Co., Ltd.
   “CAE Application: Warpage Prediction of Resin Components After Assembly”
5. C-Set Co., Ltd.
   “Current Trends in the Use of 3D Visualization Tools in the Die & Mold Industry”

How to Register

① Online Registration
Please complete your registration via the Google Form below:
↓↓↓
https://forms.gle/EM3kx7RLJu1TszKm6

② Fax or Email Registration
Download and complete the attached registration form, then submit it by:

• Fax: 06-6479-1479
• Email: mailto:r.tsuji@jdmia.or.jp

※ Registration Deadline: Monday, March 9, 2026
※ After the deadline, registered participants will receive an email with detailed instructions on how to join the event 2–3 days prior to the seminar.

Contact for Inquiries & Registration

Japan Die & Mold Industry Association (JDMIA), Western Branch
Attn: Mr. Tsujii

• Tel: 06-6479-1477
• Fax: 06-6479-1479
• Email: mailto:r.tsuji@jdmia.or.jp

Please refer to the attached document titled “Invitation to the 14th Die & Mold-Related Technology Presentation Seminar – March 17, 2026” for full details when registering.

Thank you for your interest and support!