(Eastern Branch)<br>The 51st Die & Mold–Related Technology Presentation Seminar<br>Announcement & Call for Attendees<br>The Post-Seminar Networking Reception Is Back!

(Eastern Branch)
The 51st Die & Mold–Related Technology Presentation Seminar
Announcement & Call for Attendees
The Post-Seminar Networking Reception Is Back!

Details

Hosted by the Eastern Branch Technical Committee

Announcement of the
51st Die & Mold–Related Technology Presentation Seminar

Date: Wednesday, February 4, 2026
Venue: Machinery Promotion Hall
(Minato-ku, Tokyo – directly in front of Tokyo Tower)

★ Presentations on the latest technologies and advanced craftsmanship attracting attention today
★ Theme: Improving efficiency on the manufacturing floor
★ Panel Discussion
“Improving Efficiency in Machining Operations
— The Issues Happen on the Shop Floor!”

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■ Six die and mold–related manufacturers that are actively engaged in new technology development and the enhancement of skilled techniques will present their in-house initiatives and practical efforts.

In addition, a panel discussion will be held under the theme “Improving Efficiency in Machining Operations.”
For this session, professionals from die and mold–related companies who are actively working on the front lines of manufacturing will take the stage to discuss:

  • How efficiency is being improved in their own facilities
  • What is being done at other companies
  • What challenges they are currently facing on the shop floor

Industry leaders with deep firsthand knowledge of production sites will candidly share their real experiences and concerns.
— The issues truly happen on the shop floor!

Please look forward to the “chemical reactions” that emerge from this dynamic discussion.

This seminar will be held at a new venue, Machinery Promotion Hall.
A networking reception will also be held after the seminar, and we sincerely look forward to your participation.

For further details, please refer to the attached document.

Those wishing to attend are requested to register via the URL below (Google Form) or by submitting the application form included in the attachment.
Registration deadline: Friday, January 16, 2026.