Forum Topic: International Die & mould Industry Report & Collaborative Development Forum on Forming Supply Chain

Date & Venue: June 3, 2025 | 14:00–17:00

Xinghui Hall, 2nd Floor, Yan’an Hotel, Shanghai, China

Hosts:

Mr. Ryan Huang  (President, China Die & Mould Industry Association)

Mr. Li Jianjun (Vice President, China Die & Mould Industry Association)

Keynote Speakers & Topics:

• Mr. Masahito Yamanaka (President, Japan Die & Mould Industry Association)

Topic: "Introduction of Die and Mold industries and current technical developments in Japan"

• Mr. Shin Yong Mun (President, Korea Die & Mould Industry Association)

Topic: "The Current Status and Future Development Strategies of Korea’s Die & Mold Industry"

• Ms.Paggy Zhang (Director of ACCIO Shanghai OfficeZhang)

Topic: "Leveraging Catalonia, Spain, to Unlock New Opportunities in European and Latin American Markets"

• Mr. Yi Ping ( Chairman of EMan Technology)

Topic: "Integrated Digital Solutions for mould & Injection moulding Waste Recycling"

• Mr. Yao Xiaochun (Chairman of VISION TECH)

Topic: "Building a 'Chain Collaboration System' in mould Forming"

• Mr. Wang Zhe (Product Director of Beijing FANUC )

Topic: "FANUC Laser Texture Processing Solutions"

Join global industry leaders and experts to explore innovations, strategies, and collaborative opportunities shaping the future of mould technology and supply chains.

Highlights: Cross-border insights, digital transformation trends, and actionable solutions for sustainable growth.

Save the Date!

DMC 2025 | June 4–7, Shanghai New International Expo Centre